—Capacitive Micromachined Ultrasonic Transducers (CMUTs) Are commonly fabricated either by standard sacrificial launch process or by wafer bonding technique. From the former, sacrificial levels are patterned with deposited materials to the substrate. This current work studies a development around the aforementioned technique wherein sacrificial islands are embedded within grooves opened http://reidxueh532.lucialpiazzale.com/8-videos-about-reaction-bonded-silicon-carbide-that-ll-make-you-cry